|
TYPE
|
기호 |
5TP
|
7TP
|
20TP
|
| Component space (제품간 피치) |
P
|
12.7±1.0
|
30.4±1.0
|
30.0±1.0
|
| Pitch of the sprocket
holes.(이송구멍 피치) |
P0
|
12.7±0.3
|
15.0±0.2
|
30.0±0.2
|
|
P0'
|
-
|
-
|
15.0±0.2
|
| Distance between
center of terminal and sprocket hole.(이송구명 위치 편차) |
P1
|
3.85±0.7
|
3.75±0.5
|
5.0±0.5
|
|
P2
|
6.35±1.0
|
7.5±1.0
|
15.0±1.0
|
Distance between centers
of component leads.
(리드선 간격) |
F
|
5.0±0.3
|
7.5±0.3
|
20.0±0.3
|
| Maximum lateral deviation
of the component body vertical to the tape plane.(제품수직
편차) |
Δh
|
0±1.0
|
| Carrier tape width.(대지폭) |
W
|
18.0±0.5
|
| Hold down tape width.(접착테이프
폭) |
W0
|
12.5min
|
| Distance between the center
of upper edges of carrier tape and sprocket hole.(이송구멍
위치편차) |
W1
|
9.0±0.5
|
| Distance between the upper
edges of carrier tape an the hole down tape.(접착테이프
편차) |
W2
|
0 ~ 3.0
|
Height of component from
center.
(제품 하단부 높이) |
H
|
22.0±1.0 |
22.0±1.0 |
Distance between the abscissa
and the reference plane of component with
crimped leads.
(리스선 포밍 높이) |
H0
|
16.0±0.5
|
| Protrusion lead beyond carrier
tape.(리드선 삐침) |
ℓ
|
1.0 or less
|
| Diameter of sprocket holes.(이송구멍
위치) |
D0
|
4.0ρ±0.2
|
Total thickness of the combined
carrier tape and hold down tape.
(대지+테이프 두께) |
t
|
0.7±0.2
|
| Cut off position of defectives.(불량품
커팅위치) |
L
|
11.0 of less
|
